Inside of burned integrated circuit on flexible PCB membrane detail. Visible silicon wafer and fine gold wires in hole of molten microchip package DIP-20. Replacement of damaged electronic component. Stickers #406287494
Inside of burned integrated circuit on flexible PCB membrane detail. Visible silicon wafer and fine gold wires in hole of molten microchip package DIP-20. Replacement of damaged electronic component. Poster #406287494