Inside of burned integrated circuit on flexible PCB membrane detail. Visible silicon wafer and fine gold wires in hole of molten microchip package DIP-20. Replacement of damaged electronic component. Pillow #406287494
Inside of burned integrated circuit on flexible PCB membrane detail. Visible silicon wafer and fine gold wires in hole of molten microchip package DIP-20. Replacement of damaged electronic component. Pillow #406287494